For over three decades, Retronix has provided top-notch Reballing services to the High Reliability sectors, making us specialists in reballing methodologies and applications. Our expertise in reballing process excellence stems from refining our techniques to consistently achieve outstanding outcomes across various electronic component packages.
Each industry and organization has unique internal guidelines for determining the appropriate rework processes and methods. Retronix caters to its clients’ specific needs by providing exceptional Laser Reballing as well as IPC Certified Reflow Reballing services. Although Laser Reballing offers reflow-free reballing, both methods have their merits, with Reflow Reballing being approved and chosen by numerous High Reliability organizations. Reballing entails the removal and replacement of solder balls on a Ball Grid Array (BGA) component, guaranteeing reliable electrical connections and avoiding joint failures.
✓ NO REFLOW CYCLES
✓ AUTOMATED PROCESS
✓ APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS
✓ Work to JEDEC & IPC Standards
✓ Time Tested Results
✓ APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS
✓ Customised Reballing Solutions
✓ Mitigate CTE Issues
✓ APPROVALS FROM LEADING TIER 1 OEM’S AND EMS PROVIDERS
© 2024 | Retronix Ltd, North Caldeen Rd, Coatbridge, Scotland, United Kingdom. ML5 4EF | Email: sales@retronix.com | Phone: +44 (0) 1236 433 345